In situ vibration measurements on power modules under operating conditions
Publisher
Elsevier
Source
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE
Date Issued
2012-04-16
Author(s)
Nagl, Bernhard
Lederer, Martin
Trnka, A.
Khatibi, Golta
Thoben, Markus
Abstract
The subject of this investigation was determination of thermo-mechanically induced displacement of the components inside a power module under operation conditions. It is well known that lifetime of insulated gate bipolar transistor (IGBT) modules is limited by thermo-mechanical fatigue. Wire bonded interconnects inside the IGBTs count as critical sites where crack initiation and failure is observed. In this study the temperature dependent periodic deformation of wire-bonds under operating conditions was determined by using a laser Doppler vibrometer (LDV) and thermal imaging camera. Furthermore finite element analyses (FEA) were conducted to obtain the strain values needed for lifetime assessments.
Type
Konferenzbeitrag