Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

Czerny, Bernhard; Lederer, Martin; Nagl, Bernhard; Trnka, A.; Khatibi, Golta; Thoben, Markus

doi:10.1016/j.microrel.2012.06.081

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

Publisher

Elsevier

Source

Microelectronics Reliability, 52(9-10), 2353-2357

Journal

ISSN

0026-2714

Date Issued

2012-09

Author(s)

Lederer, Martin

Nagl, Bernhard

Trnka, A.

Khatibi, Golta

Thoben, Markus

DOI

10.1016/j.microrel.2012.06.081

Abstract

The lifetime of IGBT (Insulated Gate Bipolar Transistor) modules is limited by thermo-mechanical fatigue. Thereby bonding wires represent the critical links where damage initiation is observed. For the first time Laser Doppler Vibrometer measurements and thermal imaging were employed to determine the temperature-dependent deformations of bond wires at different frequencies under operation conditions. This should be considered as an important step to facilitate more precise life-time predictions of power modules in long term usage.

URI

https://people.hochschule-burgenland.at/handle/20.500.11790/1662

Type

Wissenschaftlicher Artikel