Communication Analysis of Hardware-in-the-Loop Test Method for Heat Pumps and Chillers
Publisher
Trans Tech Publications
Source
Applied Mechanics and Materials, 887, 587-596
Journal
Date Issued
2019-01
Author(s)
Subjects
Building Simulation
Hardware-in-the-Loop
Heat Chillers
Heat Pump
LabVIEW Coupling
TRNSYS Coupling
Type
Wissenschaftlicher Artikel