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  5. Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing
 
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Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing

Publisher
Elsevier
Journal
Microelectronics Reliability  
ISSN
1872-941X
Date Issued
2024-03
Author(s)
Felke, Florens
Groth, Anne
Hempel, Martin
Czerny, Bernhard  
Khatibi, Golta 
Döhler, Torsten
Geissler, Ute 
DOI
10.1016/j.microrel.2024.115337
URI
https://hdl.handle.net/20.500.11790/3802
Type
Wissenschaftlicher Artikel
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Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing.pdf

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7.4 MB

Format

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(MD5):75391063248314f628d38e2bdae44e17

 

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