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  5. A Rapid Reliability Assessment Method for Fine Wire Bonds in Power Electronic Packages
 
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A Rapid Reliability Assessment Method for Fine Wire Bonds in Power Electronic Packages

Publisher
IEEE
Date Issued
2024-09-25
Author(s)
Walter, Thomas
Czerny, Bernhard  
Khatibi, Golta 
DOI
10.1109/Austrochip62761.2024.10716214
URI
https://hdl.handle.net/20.500.11790/3901
Type
Konferenzbeitrag

 

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