Skip to main content
Log In
Log in
Log in with ORCID
New user? Click here to register.
Have you forgotten your password?
Home
HAW Burgenland
Departments
Energie & Umwelt
A Rapid Reliability Assessment Method for Fine Wire Bonds in Power Electronic Packages
Details
A Rapid Reliability Assessment Method for Fine Wire Bonds in Power Electronic Packages
Publisher
IEEE
Date Issued
2024-09-25
Author(s)
Walter, Thomas
Czerny, Bernhard
Khatibi, Golta
DOI
10.1109/Austrochip62761.2024.10716214
URI
https://hdl.handle.net/20.500.11790/3901
Type
Konferenzbeitrag