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  5. Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions
 
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Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions

Publisher
Elsevier
Source
2012 4th Electronic System-Integration Technology Conference, ESTC 2012
Date Issued
2012-09-17
Author(s)
Czerny, Bernhard  
Nagl, Bernhard 
Lederer, Martin 
Khatibi, Golta 
Thoben, Markus 
Nicolics, Johann 
DOI
10.1109/ESTC.2012.6542120
Abstract
This paper discusses different application relevant electrical loading cases of an IGBT module of a power inverter. Thereby, different operation conditions such as pulse frequencies, inverter output currents and output frequencies, as well as two different operation modes are discussed. Each load case investigation is conducted by electrical, thermal, and in situ vibration measurements. Moreover, on the base of finite element analyses a deeper insight is gained into reliability relevant thermo-mechanical behavior. For this purpose an IGBT module is operated at a load of 30% to 80% of its nominal value in order to cause representative thermo-mechanical displacements of dies and bond wires. By applying an inverter output frequency in a range of 1 to 280 Hz a temperature ripple of up to 40 K on the dies and a vertical displacement of up to 9 μm on a bond wire is observed. These results are important to improve life-time-predictions.
URI
https://ieeexplore.ieee.org/document/6542120
http://hdl.handle.net/20.500.11790/1660
Type
Konferenzbeitrag

 

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