Communication Analysis of Hardware-in-the-Loop Test Method for Heat Pumps and Chillers

Publisher

Trans Tech Publications

Source

Applied Mechanics and Materials, 887, 587-596

Journal

Applied Mechanics and Materials

Date Issued

2019-01

Author(s)

Schoberer, Thomas

Stutterecker, Werner

DOI

10.4028/www.scientific.net/AMM.887.587

URI

http://hdl.handle.net/20.500.11790/1159

Subjects

Building Simulation

Hardware-in-the-Loop

Heat Chillers

Heat Pump

LabVIEW Coupling

TRNSYS Coupling

Type

Wissenschaftlicher Artikel