DSpace at FH Burgenland logo
Log In
New user? Click here to register.Have you forgotten your password?
  1. Home
  2. HAW Burgenland
  3. Departments
  4. Energie & Umwelt
  5. Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
 
  • Details

Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics

Publisher
IMAPS
Source
Journal of Microelectronics & Elect Pkg, 19(2), 49-55
Journal
Journal of Microelectronics and Electronic Packaging  
ISSN
1551-4897
Date Issued
2022-06
Author(s)
Czerny, Bernhard  
Khatibi, Golta 
Abstract
This article presents various experimental studies on fatigue evaluation of wire bond interconnects and interfaces in electronic devices using an accelerated mechanical fatigue testing system. This dedicated experimental setup is designed to induce fatigue failure in the weak sites of the wire bond by reproducing the thermomechanical failure modes occurring during operation. An exceptional highly test acceleration is achieved by increasing the mechanical testing frequency into the kHz regimen enabling the determination of lifetime curves in a very short time. A com parison of this method to conventional testing methods such as power cycling, a shear testing exploits the potential of customized accelerated mechanical testing. Exemplary studies on the degra dation and fatigue failure of heavy Al wire bonds typically used in power electronics and novel Cu wire bonds are presented and advantages and some restrictions of the proposed method are discussed.
URI
http://hdl.handle.net/20.500.11790/1848
https://imapsjmep.org/article/37422
Subjects
CTE mismatch
shear test
IGBT power module reliability
power cycling
thermomechanical fatigue
wire bond interconnects
accelerated testing
BAMFIT
wire bond interconnects
wire bond lift-off
wire bond interconnects
Type
Wissenschaftlicher Artikel

 

FHB is participating in:

Built with DSpace-CRIS software - Extension maintained and optimized by 4Science

  • Privacy policy
  • End User Agreement
  • Send Feedback