A new approach for evaluation of fatigue life of al wire bonds in power electronics

Ultrasonically bonded A1 wire bonds on A1 metallization pads are widely used in power semiconductors. The required long time reliability of the devices is highly dependent on the interfacial quality of A1 wire and the bond pad. Reliability of wire bonds is commonly assessed by thermal and power cycling tests. Accelerated mechanical fatigue testing can be used as an alternative to these time consuming procedures. In the present study, lifetime of thick A1 wedge bonds on Si substrates was investigated using a novel mechanical fatigue testing technique operating at high frequencies and elevated temperatures. The influence of microstructure, testing temperature and frequency on lifetime of A1 wire bonds was investigated. Finite element analysis was applied to calculate the stress distribution at the interfacial region and to establish life time prediction curves. The results of mechanical isothermal fatigue curves were compared and correlated with thermal cycling data of Al wire bonds. Copyright © 2014 by The Minerals, Metals & Materials Society.