Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors
Publisher
IEEE
Date Issued
2007-05
Author(s)
Nicolics, Johann
Mündlein, Martin
Zluc, A.
Stahr, H.
Franz, M
Conference
Subjects
glass fibre reinforced plastics
printed circuit layout
printed circuit manufacture
printed circuits
thermal analysis
thermal conductivity
Type
Konferenzbeitrag