Czerny, BernhardBernhardCzerny0000-0001-8147-3122Thoben, MarkusMarkusThobenKhatibi, GoltaGoltaKhatibiLederer, MartinMartinLedererNagl, BernhardBernhardNaglNicolics, JohannJohannNicolics2021-10-302021-10-302013-05-26Proceedings of the International Symposium on Power Semiconductor Devices and ICs, 293-296978-146735134-81063-6854http://hdl.handle.net/20.500.11790/1657https://ieeexplore.ieee.org/document/6694467This study comprises the electrical analysis of an experimental investigation on thermo-mechanical vibration measurements on an IGBT inverter structure under operating conditions and shows a new way how to experience reliability relevant phenomena. In order to perform transient temperature measurements with IR thermography and optical vibration measurements one sub-system of the inverter module was extracted and operated at equivalent conditions. Necessary circuit modifications including parasitic impedances and their most important influences are discussed. The investigation revealed a strong dependence of the thermo-mechanical bonding wire vibrations on the inverter output frequency. At 1 Hz an amplitude of more than 4 μm was measured at the loop peak of a short bonding wire.enKonferenzbeitrag10.1109/ISPSD.2013.669446710.1109/EuroSimE.2013.6529909