Communication Analysis of Hardware-in-the-Loop Test Method for Heat Pumps and Chillers

Weyr, JanJanWeyrSchoberer, ThomasThomasSchobererStutterecker, WernerWernerStutterecker2019-04-052019-04-052019-01Applied Mechanics and Materials, 887, 587-5961660-9336http://hdl.handle.net/20.500.11790/115912th Envibuild – Buildings and Environment – From Research to Applicationeninfo:eu-repo/semantics/closedAccessBuilding SimulationHardware-in-the-LoopHeat ChillersHeat PumpLabVIEW CouplingTRNSYS CouplingCommunication Analysis of Hardware-in-the-Loop Test Method for Heat Pumps and ChillersWissenschaftlicher Artikel10.4028/www.scientific.net/AMM.887.587