A Rapid Reliability Assessment Method for Fine Wire Bonds in Power Electronic Packages

Walter, ThomasThomasWalterCzerny, BernhardBernhardCzernyKhatibi, GoltaGoltaKhatibi2025-04-012025-04-012024-09-25https://hdl.handle.net/20.500.11790/3901A Rapid Reliability Assessment Method for Fine Wire Bonds in Power Electronic PackagesKonferenzbeitrag10.1109/Austrochip62761.2024.10716214