Nicolics, JohannJohannNicolicsMündlein, MartinMartinMündleinHanreich, GernotGernotHanreichZluc, A.A.ZlucStahr, H.H.StahrFranz, MMFranz2021-03-262021-03-262007-05978-1-4244-1217-4http://hdl.handle.net/20.500.11790/1495eninfo:eu-repo/semantics/closedAccessglass fibre reinforced plasticsprinted circuit layoutprinted circuit manufactureprinted circuitsthermal analysisthermal conductivityThermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer ResistorsKonferenzbeitrag10.1109/ISSE.2007.4432819