Loop formation effects on the lifetime of wire bonds for power electronics
Source
CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1-6.
Date Issued
2020-03-24
Author(s)
Ribbeck, Hans-Georg von
Doehler, Torsten
Khatibi, Golta
Geissler, Ute
Abstract
In the present work, the influence of loop forming aspects on the reliability of US-bonded aluminium heavy wires was studied, combining three measurement techniques, for the first time: Laser confocal microscopy based wrinkling characterization, accelerated lifetime measurements BAMFIT and destructive pull tests. The focus of this study was the systematic investigation of the heel region of the wire bond depending on process parameters and especially on the loop geometry regarding durability and lifetime. As first results, effects reducing durability were identified which are not apparent in normal testing and a recommendation for the use of reverse movements can be given.
Type
Konferenzbeitrag